The new FLIR High Operating Temperature (HOT) focal plane array (FPA) technology, is cooled by a new FLIR linear micro-cooler, and uses FLIR Boson™ image-processing electronics. This leads to faster time to image, longer cooler lifetime, low power consumption, rugged construction and a wide operating temperature range.
Small, light, and powerful, the FLIR Neutrino LC produces superb thermal imagery using a HOT 640 x 512 15µm FPA, while weighing in at only 370 grams. The Neutrino LC has built-in support for physical and protocol-level industry standards (e.g. USB2), has a full suite of hardware accessories and possesses FLIR XIR™ (expandable infrared video processing architecture and robust SDK).
The FLIR Neutrino LC offers increased reliability and low-vibration linear micro-cooler, faster time to image and FLIR reliability and support.